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PC452J00000F series 1. recognized by ul1577 (double protection isolation), file no. e64380 (as model no. pc452 ) 2. package resin : ul flammability grade (94v-0) features agency approvals/compliance 1. telephone sets 2. copiers, facsimiles 3. interfaces with various power supply circuits, power distribution boards 4. hybrid substrates which reguire high density mounting applications mini-flat package, darlinton phototransistor output, high collector-emitter voltage photocoupler 1. 4-pin mini-flat package 2. double transfer mold package (ideal for flow soldering) 3. high collector-emitter voltage (v ceo : 350v) 4. darlington phototransistor output (ctr : min. 1 000% at i f = 1ma, v ce = 2v) 5. high isolation voltage between input and output (v iso(rms) : 3.75kv) 6. lead-free and rohs directive compliant description PC452J00000F series contains an ired optically coupled to a phototransistor. it is packaged in a 4-pin mini-flat. input-output isolation voltage(rms) is 3.75kv. collector-emitter voltage is 350v and ctr is min. 1 000% at input current of 1.0ma. 1 sheet no.: d2-a00902en date jun. 30. 2005 ?sharp corporation notice the content of data sheet is subject to change without prior notice. in the absence of confirmation by device specification sheets, sharp takes no responsibility for any defects that may occur in equipment using any sharp devices shown in catalogs, data books, etc. contact sharp in order to obtain the latest device specification sheets before usin g any sharp device. PC452J00000F series
internal connection diagram anode cathode emitter collector 1 1 2 3 4 2 4 3 2 sheet no.: d2-a00902en outline dimensions (unit : mm) pc452 sharp mark "s" date code factory identification mark 5.3 0.3 2.6 0.2 0.1 0.1 0.5 + 0.4 ? 0.2 7.0 + 0.2 ? 0.7 anode mark epoxy resin 45? 6? 0.2 0.05 1 2 0.4 0.1 4.4 0.2 4 3 3.6 0.3 2.54 0.25 PC452J00000F series product mass : approx. 0.1g plating material : sncu (cu : typ. 2%)
date code (2 digit) a.d. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 mark a b c d e f h j k l m n mark p r s t u v w x a b c mark 1 2 3 4 5 6 7 8 9 o n d month january february march april may june july august september october november december a.d 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2nd digit month of production 1st digit year of production 3 repeats in a 20 year cycle sheet no.: d2-a00902en PC452J00000F series factory identification mark factory identification mark no mark country of origin japan indonesia china * this factory marking is for identification purpose only. please contact the local sharp sales reprsentative to see the actual status of the production. rank mark there is no rank mark indicator.
sheet no.: d2-a00902en electro-optical characteristics parameter conditions forward voltage reverse current terminal capacitance collector dark current transfer charac- teristics collector current collector-emitter breakdown voltage collector-emitter saturation voltage isolation resistance cut-off frequency min. ? ? ? ? 10 ? 5 10 10 1 ? ? typ. 1.2 ? 30 ? ? ? ? 1 10 11 7 100 20 max. 1.4 10 250 200 ? ? 1.2 ? ? 300 100 unit v v a pf na ma v ? khz s s symbol v f i r c t i ceo bv ceo i c v ce (sat) f c t r t f r iso response time rise time fall time input output i f = 10ma v r = 4v v = 0, f = 1khz v ce = 200v, i f = 0 i c = 0.1ma, i f = 0 i f = 1ma, v ce = 2v dc500v, 40 to 60%rh v ce = 2v, i c = 20ma, r l = 100 ? v ce =2 v, i c = 20ma, r l = 100 ? , ? 3db floating capacitance ? 0.6 1.0 pf c f v = 0, f = 1mhz i f = 20ma, i c = 100ma 350 (t a = 25?c) absolute maximum ratings (t a = 25?c) parameter symbol unit input forward current ma power dissipation mw output collector-emitter voltage v emitter-collector voltage v collector current ma collector power dissipation mw total power dissipation mw *1 isolation voltage operating temperature ?c storage temperature ?c *2 soldering temperature i f p v ceo v eco i c p c p tot v iso (rms) t opr t stg t sol ?c *1 40 to 60%rh, ac for 1 minute, f = 60hz *2 for 10s rating 50 70 reverse voltage v v r 6 350 0.1 150 150 170 ? 30 to + 100 ? 40 to + 125 260 3.75 kv 4 PC452J00000F series
sheet no.: d2-a00902en model line-up 5 please contact a local sharp sales representative to inquire about production status. PC452J00000F series package model no. PC452J00000F taping 3 000 pcs/reel pc452tj0000f 750 pcs/reel
sheet no.: d2-a00902en 50?c 25?c 0?c 0 0.5 1 1.5 2 2.5 3 10 100 1 ? 25?c t a = 75?c forward current i f (ma) forward voltage v f (v) fig.4 forward current vs. forward voltage duty ratio 10 100 peak forward current i fm (ma) 10 ? 3 10 ? 2 10 ? 1 pulse width 100 s t a = 25?c 1 10 000 1 000 fig.3 peak forward current vs. duty ratio 0 ? 30 10 025507 5 100 125 20 30 40 50 60 ambient temperature t a (?c) forward current i f (ma) fig.1 forward current vs. ambient temperature ? 30 0 25 50 75 100 125 ambient temperature t a (?c) 0 100 200 50 150 collector power dissipation p c (mw) fig.2 collector power dissipation vs. ambient temperature 6 0 0.1 current transfer ratio ctr (%) 10 1 forward current i f (ma) v ce = 2v t a = 25?c 5 000 4 000 3 000 2 000 1 000 fig.5 current transfer ratio vs. forward current 0 012345 100 200 0.5ma 1ma 1.5ma 2ma 2.5ma 3ma 5ma i f = 10ma p c (max.) collector-emitter voltage v ce (v) collector current ic (ma) t a = 25?c fig.6 collector current vs. collector-emitter voltage PC452J00000F series
sheet no.: d2-a00902en collector dark current i ceo (a) 10 ? 5 10 ? 6 10 ? 7 10 ? 8 10 ? 9 10 ? 10 10 ? 11 80 60 40 ? 30 0 20 100 ambient temperature t a (?c) v ce = 200v fig.9 collector dark current vs. ambient temperature 1 10 100 1 000 0.01 0.1 1 10 response time ( s) t s t d t f t r load resistance r l (k ? ) v ce = 2v i c = 20ma t a = 25?c fig.10 response time vs. load resistance 80 60 0 40 50 100 150 relative current transfer ratio (%) ? 30 0 20 100 ambient temperature t a (?c) i f = 1ma v ce = 2v fig.7 relative current transfer ratio vs. ambient temperature 0 0.2 0.4 0.6 0.8 1 1.2 i f = 20ma i c = 100ma collector-emitter saturation voltage v ce(sat) (v) 80 60 40 ? 30 0 20 100 ambient temperature t a (?c) fig.8 collector - emitter saturation voltage vs. ambient temperature 7 fig.11 test circuit for response time frequency f (khz) 0 0.1 1 10 100 100 ? 10 ? voltage gain a v (db) r l = 1k ? 1 000 ? 5 ? 10 ? 15 ? 20 ? 25 v ce = 2v i c = 20ma t a = 25?c fig.12 frequency response PC452J00000F series 10% input output input output 90% t s t d v cc v ce r d r l t f t r please refer to the conditions in fig.10
sheet no.: d2-a00902en 8 PC452J00000F series collector-emitter saturation voltage v ce(sat) (v) forward current i f (ma) 0 012345 1 2 3 4 5 ic = 5ma 10ma 30ma 50ma 70ma 100ma t a = 25?c fig.13 collector-emitter saturation voltage vs. forward current remarks : please be aware that all data in the graph are just for reference and not for guarantee.
sheet no.: d2-a00902en design considerations while operating at i f <1.0ma, ctr variation may increase. please make design considering this fact. this product is not designed against irradiation and incorporates non-coherent ired. degradation in general, the emission of the ired used in photocouplers will degrade over time. in the case of long term operation, please take the general ired degradation (50% degradation over 5 years) into the design consideration. recommended foot print (reference) ? for additional design assistance, please review our corresponding optoelectronic application notes. 9 1.5 2.54 0.8 6.3 (unit : mm) design guide PC452J00000F series
sheet no.: d2-a00902en manufacturing guidelines reflow soldering: reflow soldering should follow the temperature profile shown below. soldering should not exceed the curve of temperature profile and time. please don't solder more than twice. soldering method flow soldering : due to sharp's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. flow soldering should be completed below 260?c and within 10s. preheating is within the bounds of 100 to 150?c and 30 to 80s. please don't solder more than twice. hand soldering hand soldering should be completed within 3s when the point of solder iron is below 400?c. please don't solder more than twice. other notices please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and pcb varies depending on the tooling and soldering conditions. 10 1234 300 200 100 0 0 (?c) terminal : 260?c peak ( package surface : 250?c peak) preheat 150 to 180?c, 120s or less reflow 220?c or more, 60s or less (min) PC452J00000F series
sheet no.: d2-a00902en solvent cleaning: solvent temperature should be 45?c or below immersion time should be 3 minutes or less ultrasonic cleaning: the impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of pcb and mounting method of the device. therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. recommended solvent materials: ethyl alcohol, methyl alcohol and isopropyl alcohol in case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin. cleaning instructions this product shall not contain the following materials. and they are not used in the production process for this product. regulation substances : cfcs, halon, carbon tetrachloride, 1.1.1-trichloroethane (methylchloroform) specific brominated flame retardants such as the pbbos and pbbs are not used in this product at all. this product shall not contain the following materials banned in the rohs directive (2002/95/ec). ?ead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (pbb), polybrominated diphenyl ethers (pbde). presence of odc 11 PC452J00000F series
sheet no.: d2-a00902en 12 tape and reel package 1. 3 000pcs/reel package materials carrier tape : a-pet (with anti-static material) cover tape : pet (three layer system) reel : ps carrier tape structure and dimensions a 12.0 0.3 b 5.5 0.1 c 1.75 0.1 d 8.0 0.1 e 2.0 0.1 h 7.4 0.1 i 0.3 0.05 j 3.1 0.1 k 4.0 0.1 f 4.0 0.1 g 1.5 + 0.1 ? 0 f e i d j g b a c h k h dimensions list (unit : mm) 5? max. a c e g f b d a 370 b 13.5 1.5 c 80 1.0 d 13 0.5 e 21 1.0 f 2.0 0.5 g 2.0 0.5 dimensions list (unit : mm) pull-out direction [packing : 3 000pcs/reel] reel structure and dimensions direction of product insertion PC452J00000F series package specification
sheet no.: d2-a00902en 2. 750 pcs / reel package materials carrier tape : a-pet (with anti-static material) cover tape : pet (three layer system) reel : ps carrier tape structure and dimensions 13 a 12.0 0.3 b 5.5 0.1 c 1.75 0.1 d 8.0 0.1 e 2.0 0.1 h 7.4 0.1 i 0.3 0.05 j 3.1 0.1 k 4.0 0.1 f 4.0 0.1 g 1.5 + 0.1 ? 0 f e i d j g b a c h dimensions list (unit : mm) k h 5? max. a c e g f b d a 180 b 13.5 1.5 c 80 1.0 d 13 0.5 e 21 1.0 f 2.0 0.5 g 2.0 0.5 dimensions list (unit : mm) pull-out direction [packing : 750pcs/reel] reel structure and dimensions direction of product insertion PC452J00000F series
?the circuit application examples in this publication are provided to explain representative applications of sharp devices and are not intended to guarantee any circuit design or license any intellectual property rights. sharp takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of sharp's devices. ?contact sharp in order to obtain the latest device specification sheets before using any sharp device. sharp reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. manufacturing locations are also subject to change without notice. ?observe the following points when using any devices in this publication. sharp takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) the devices in this publication are designed for use in general electronic equipment designs such as: --- personal computers --- office automation equipment --- telecommunication equipment [terminal] --- test and measurement equipment --- industrial control --- audio visual equipment --- consumer electronics (ii) measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when sharp devices are used for or in connection with equipment that requires higher reliability such as: - -- transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- traffic signals --- gas leakage sensor breakers --- alarm equipment --- various safety devices, etc. (iii) sharp devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- space applications --- telecommunication equipment [trunk lines] --- nuclear power control equipment - -- medical and other life support equipment (e.g., scuba). ?if the sharp devices listed in this publication fall within the scope of strategic products described in the foreign exchange and foreign trade law of japan, it is necessary to obtain approval to export such sharp devices. ?this publication is the proprietary product of sharp and is copyrighted, with all rights reserved. under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of sharp. express written permission is also required before any use of this publication may be made by a third party. ?contact and consult with a sharp representative if there are any questions about the contents of this publication. 14 sheet no.: d2-a00902en important notices PC452J00000F series [e201]

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